Magnetron-sputtered TiNiCu shape memory alloy thin films with different Cu contents

Yongqing Fu; Hejun Du

doi:10.1117/12.468645

13 November 2002 Magnetron sputtered TiNiCu shape memory alloy thin films with different Cu contents

Yongqing Fu, Hejun Du

Proceedings Volume 4934, Smart Materials II; (2002) https://doi.org/10.1117/12.468645
Event: SPIE's International Symposium on Smart Materials, Nano-, and Micro- Smart Systems, 2002, Melbourne, Australia

Abstract

TiNiCu films with different Cu contents were prepared by co-sputtering of TiNi and Cu targets using a magnetron sputtering system. Film microstructure, phase transformation behavior and crystallized structures were characterized. The substitution of Ni by Cu in TiNi based films resulted in a dramatic change in martensite structure and film orientation. With the increase of Cu content in the films, both the transformation temperatures and hysteresis decreases significantly from both differential scanning calorimeter (DSC) and X-ray diffraction (XRD) results. However, from both DSC and curvature measurement results, the specific heat and the maximum recovery stress generated during martensite transformation decreases.

Citation Download Citation

Yongqing Fu and Hejun Du "Magnetron sputtered TiNiCu shape memory alloy thin films with different Cu contents", Proc. SPIE 4934, Smart Materials II, (13 November 2002); https://doi.org/10.1117/12.468645

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