Development of embedded sensor models in composite laminates for structural health monitoring

Heung Soo Kim; Anindya Ghoshal; Aditi Chattopadhyay; William H. Prosser

doi:10.1117/12.483493

5 August 2003 Development of embedded sensor models in composite laminates for structural health monitoring

Heung Soo Kim, Anindya Ghoshal, Aditi Chattopadhyay, William H. Prosser

Proceedings Volume 5056, Smart Structures and Materials 2003: Smart Structures and Integrated Systems; (2003) https://doi.org/10.1117/12.483493
Event: Smart Structures and Materials, 2003, San Diego, California, United States

Abstract

A new improved nonlinear transient generalized layerwise theory for modeling embedded discrete and continuous sensor(s) outputs in laminated composite plates with acoustic emission from cracks and embedded delaminations is developed. The computational modeling involves development of a finite element scheme using an improved layerwise laminate theory for a composite laminate plate with embedded discrete and continuous sensors and embedded discrete delaminations. The simulated cases studied included cantilever plates with embedded sensors and embedded delamination under low frequency vibration and square plates with discrete embedded sensors and continuous embedded sensor architecture and embedded discrete delaminations under high frequency acoustic emission. The effect on sensor outputs due to scattering of the acoustic emission due to the presence of delamination is also investigated. It is expected that this analytical model would be a useful tool for numerical simulation of composite laminated structures with embedded delaminations and embedded sensor architecture, particularly since experimental investigation could often be prohibitive to simulate different conditions.

Citation Download Citation

Heung Soo Kim, Anindya Ghoshal, Aditi Chattopadhyay, and William H. Prosser "Development of embedded sensor models in composite laminates for structural health monitoring", Proc. SPIE 5056, Smart Structures and Materials 2003: Smart Structures and Integrated Systems, (5 August 2003); https://doi.org/10.1117/12.483493

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