Warpage measurement system with systematic error analysis

Yu Qiu; Hai Ding; I. Charles Ume; Yilan Kang

doi:10.1117/12.509911

29 April 2003 Warpage measurement system with systematic error analysis

Yu Qiu, Hai Ding, I. Charles Ume, Yilan Kang

Proceedings Volume 5058, Optical Technology and Image Processing for Fluids and Solids Diagnostics 2002; (2003) https://doi.org/10.1117/12.509911
Event: Optical Technology and Image Processing for Fluids and Solids Diagnostics 2002, 2002, Beijing, China

Abstract

Out-of-plane displacement of the electronic package is an essential source of the electronic device failure. It is caused from the mismatch of the coefficient of thermal expansion among different parts of IC device. Here a projection Moire system is presented for monitoring and analyzing warpage during packaging. Projection Moire is particularly useful to measure warpage of surfaces with components. While this method shows promising features, it will give erroneous results if improperly used. In this paper, the formula of the systematic erro is deduced. Based onteh analysis, compensation could be done to eliminate the systematic error and guarantee an accurate measurement results.

Citation Download Citation

Yu Qiu, Hai Ding, I. Charles Ume, and Yilan Kang "Warpage measurement system with systematic error analysis", Proc. SPIE 5058, Optical Technology and Image Processing for Fluids and Solids Diagnostics 2002, (29 April 2003); https://doi.org/10.1117/12.509911

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