Paper
3 May 2004 Interaction of RET and MDP: optimization for reducing the mask writing time
Author Affiliations +
Abstract
As the industry is targeting the sub-100nm nodes the pressure on the data path and tapeout flow is growing. Design complexity and increased deployment of resolution enhancement techniques (RET) result in rapidly growing file sizes, which impacts the data preparation time, especially for variable-shaped beam mask writing machines. Properties of the incoming layout - hierarchy, grid and aggressiveness of the RET are the main factors. Tuning the OPC without compromising the lithographic performance while achieving the shortest processing time is the target. The study investigates the impact of OPC setup with a focus on using the functional intent of the design to influence the aggressiveness of the correction. The correlation to the performance parameters for the mask data preparation and mask writing, like run-time, file size, shot count and small figures, will be reported.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
James Word and Steffen F. Schulze "Interaction of RET and MDP: optimization for reducing the mask writing time", Proc. SPIE 5379, Design and Process Integration for Microelectronic Manufacturing II, (3 May 2004); https://doi.org/10.1117/12.535653
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Cited by 1 scholarly publication.
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KEYWORDS
Optical proximity correction

Photomasks

Resolution enhancement technologies

Metals

Manufacturing

Tolerancing

Lithography

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