Paper
16 June 2005 Accurate aerial image simulation using high-resolution reticle inspection images
Author Affiliations +
Proceedings Volume 5835, 21st European Mask and Lithography Conference; (2005) https://doi.org/10.1117/12.637289
Event: 21st European Mask and Lithography Conference, 2005, Dresden, Germany
Abstract
The use of hardware-based and software-based reticle defect printability simulation systems is expanding as the cost and complexity of reticles increases. Without such systems it has become increasingly difficult to predict the lithographic significance of a defect found on a reticle. The viability of such systems can be judged using several criteria including accuracy, ease of use, level of automation, and the degree to which they can be applied to a wide range of reticle types. Simulation systems have improved in each of these areas. Automated and semi-automated systems have now been developed and integrated into reticle manufacturing. We report on advances made in a software-based simulation system which uses high-resolution reticle inspection images as the basis for the description of the reticle. We show that the simulated aerial images can be compared quantitatively to results from a hardware-based simulation system (the Zeiss AIMSTM tool) for both 193 and 248 nm EPSM reticles. The development of a new set of metrics to judge lithographic significance will be explained. Common procedural mistakes in evaluating the impact of a defect will be discussed.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
William B. Howard and Chris A. Mack "Accurate aerial image simulation using high-resolution reticle inspection images", Proc. SPIE 5835, 21st European Mask and Lithography Conference, (16 June 2005); https://doi.org/10.1117/12.637289
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KEYWORDS
Reticles

Inspection

Metrology

Lithography

Computer simulations

Semiconducting wafers

Photomasks

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