Print characterization of photomasks from next-generation deep-ultra-violet laser pattern generator

Curt Jackson; Robert Kiefer; Peter Buck; David Mellenthin; John Manfredo; Vishal Garg; Jason Hickethier; Sarah Cohen; Cris Morgante; Paul C. Allen; Eric Christenson; Michael White

doi:10.1117/12.617524

28 June 2005 Print characterization of photomasks from next-generation deep-ultra-violet laser pattern generator

Curt Jackson, Robert Kiefer, Peter Buck, David Mellenthin, John Manfredo, Vishal Garg, Jason Hickethier, Sarah Cohen, Cris Morgante, Paul C. Allen, Eric Christenson, Michael White

Author Affiliations +

Proceedings Volume 5853, Photomask and Next-Generation Lithography Mask Technology XII; (2005) https://doi.org/10.1117/12.617524
Event: Photomask and Next Generation Lithography Mask Technology XII, 2005, Yokohama, Japan

Abstract

Currently, the ALTA 4300 generation DUV Laser tool is capable of printing critical and semi-critical photomasks for the 130nm and 90nm IC technology nodes. With improved optical elements, an improved objective lens, and a higher bandwidth data-path the capability of the tool has been dramatically enhanced - culminating with the introduction of the ALTA 4700. Both the ALTA 4300 system’s diffractive optic element (DOE) and acousto-optic modulator (AOM) have been refined. Additionally, the ALTA 4300 system’s 33x, 0.8NA objective lens has been replaced with a 42x, 0.9NA objective lens. Finally, the tool’s data-path has been enhanced to maintain the ALTA system’s superior write time on critical mask layers. Quantitative results of these enhancements will be detailed through reporting of critical feature resolution limits, CD uniformity control, and pattern placement accuracy on mask. Performance will be shown from masks printed pre- and post- hardware upgrade. Experimental results will be compared with theoretical calculations that show expected and actual improvements. In this paper details of the aerial image created when printing wafers with DUV Laser generated photomasks pre- and post- upgrade will be shown. 193nm print results will be shown with multiple illumination conditions. Details of a print test comparison performed on photomasks from each tool configuration will be documented. The print test comparison will include process window characterization from each mask type.

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Curt Jackson, Robert Kiefer, Peter Buck, David Mellenthin, John Manfredo, Vishal Garg, Jason Hickethier, Sarah Cohen, Cris Morgante, Paul C. Allen, Eric Christenson, and Michael White "Print characterization of photomasks from next-generation deep-ultra-violet laser pattern generator", Proc. SPIE 5853, Photomask and Next-Generation Lithography Mask Technology XII, (28 June 2005); https://doi.org/10.1117/12.617524

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KEYWORDS

Photomasks

Deep ultraviolet

Semiconducting wafers

Bragg cells

Diffractive optical elements

Image enhancement

Objectives

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