Paper
18 January 2006 Quantification of line mura defect levels based on multiple characterizing features
Author Affiliations +
Proceedings Volume 6066, Vision Geometry XIV; 606603 (2006) https://doi.org/10.1117/12.642828
Event: Electronic Imaging 2006, 2006, San Jose, California, United States
Abstract
Recently, with an increasing FPD market, automatic detection of the mura in the manufacturing process has become a critical issue for manufactures interested in increasing their TFT-LCD quality. But segmentation based detection algorithms deviate from human visual perception model. To supplement the detection error produced by deviation, the mura is re-inspected through a visual inspection during manufacturing process. If we could objectively quantify each mura's defect degree, then based on some threshold of defect degree, we could reduce the number of re-inspection. We call this degree line muras defect level. Our approach is an attempt to quantify the ideal defect level of line mura, that for each individual could vary because of subjectivity, based on multiple features crucial in the detection of line mura. In the process, we approximated what we call JND surface that passes through the middle of feature points with mean mura visibility of 0.5. Then Index function, which measures distance from JND surface, is employed to measure the objective defect level of each candidate mura.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
No K. Park, Kyu N. Choi, and Suk I. Yoo "Quantification of line mura defect levels based on multiple characterizing features", Proc. SPIE 6066, Vision Geometry XIV, 606603 (18 January 2006); https://doi.org/10.1117/12.642828
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KEYWORDS
Visibility

Optical inspection

Inspection

Visualization

Manufacturing

Distance measurement

Visual process modeling

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