Paper
20 October 2006 Evaluation of bi-layer TaSix absorber on buffer for EUV mask
Koichiro Kanayama, Shinpei Tamura, Yasushi Nishiyama, Masashi Kawashita, Tadashi Matsuo, Akira Tamura, Susumu Nagashige, Kenji Hiruma, Doohoon Goo, Iwao Nishiyama
Author Affiliations +
Abstract
We evaluated TaSix-based bi-layer absorber on ZrSi-based buffer for EUV mask, especially considering the possibility of ZrSi-based film as a combined buffer and capping layer. Since ZrSi-based film has both high dry-etching resistance and EUV transparency, it has potentiality to work as a combined capping and buffer layer. AFM machining repair of bi-layer TaSix absorber on ZrSi-based buffer can be performed to good profile. Printing evaluation showed that over-repair into buffer layer did not affect significantly to wafer CD. FIB (10keV) repair of bi-layer TaSix absorber on ZrSi-based buffer needs improvement for side-wall profile and distinguishable evaluation from implanted Ga+ effect in more detail. Effect of FIB (10keV) scan with ordinary repair process seems to be at least smaller than 10%.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Koichiro Kanayama, Shinpei Tamura, Yasushi Nishiyama, Masashi Kawashita, Tadashi Matsuo, Akira Tamura, Susumu Nagashige, Kenji Hiruma, Doohoon Goo, and Iwao Nishiyama "Evaluation of bi-layer TaSix absorber on buffer for EUV mask", Proc. SPIE 6349, Photomask Technology 2006, 63493A (20 October 2006); https://doi.org/10.1117/12.686388
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Cited by 5 scholarly publications.
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KEYWORDS
Extreme ultraviolet

Gallium

Printing

Atomic force microscopy

Photomasks

Reflectivity

Silicon

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