Paper
11 February 2008 Numerical simulation of thermal damage process between laser and a photodiode for different magnitudes of pulse energy
Juan Bi, Xi-he Zhang, Xiao-wu Ni
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Abstract
Research of the interaction process between high energy pulse laser using millisecond pulse width and a PIN junction photodiode is presented. A 3-D physical modeling of the interaction is accommodated for the thermal interaction analysis. Considering variety of the thermophysical parameters, numerical method is utilized to solve governing equations of heat transfer with heat generation term. For different magnitudes of pulse energy,axial and radial temperature distribution as function of time and position before melting have been calculated, and the relevant physical process has been discussed. In addition, influence of different magnitudes of pulse energy on the temperature rise in the material composing photodiode is investigated. Numerical results show that heat conduction has effect to the whole course between laser and material interaction. Moreover, the rate of temperature rise has a deep effect for different magnitudes of pulse energy during laser irradiation.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Juan Bi, Xi-he Zhang, and Xiao-wu Ni "Numerical simulation of thermal damage process between laser and a photodiode for different magnitudes of pulse energy", Proc. SPIE 6839, Nonlinear Optics: Technologies and Applications, 683926 (11 February 2008); https://doi.org/10.1117/12.757724
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Cited by 1 scholarly publication.
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KEYWORDS
Pulsed laser operation

Photodiodes

Laser energy

Silicon

Semiconductor lasers

Laser irradiation

Laser processing

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