Study of Ag-In solder as low temperature wafer bonding intermediate layer

Riko I Made; Chee Lip Gan; Chengkuo Lee; Li Ling Yan; Aibin Yu; Seung Wook Yoon; John H. Lau

doi:10.1117/12.762046

20 February 2008 Study of Ag-In solder as low temperature wafer bonding intermediate layer

Riko I Made, Chee Lip Gan, Chengkuo Lee, Li Ling Yan, Aibin Yu, Seung Wook Yoon, John H. Lau

Proceedings Volume 6884, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII; 68840H (2008) https://doi.org/10.1117/12.762046
Event: MOEMS-MEMS 2008 Micro and Nanofabrication, 2008, San Jose, California, United States

Abstract

Indium-silver as solder materials for low temperature bonding had been introduced earlier. In theory the final bonding interface composition is determined by the overall materials composition. Wafer bonding based multiple intermediate layers facilitates precise control of the formed alloy composition and the joint thickness. Thus the bonding temperature and post-bonding re-melting temperature could be easily designed by controlling the multilayer materials. In this paper, a more fundamental study of In-Ag solder materials is carried out in chip-to-chip level by using flip-chip based thermocompression bonding. Bonding at 180°C for various time duration under various bonding pressure is studied. Approaches of forming Ag₂In with re-melting temperature higher than 400°C at the bonding interface are proposed and discussed. Knowledge learned in this process technology can support us to develop sophisticated wafer level packaging process based wafer bonding for applications of MEMS and IC packages.

Citation Download Citation

Riko I Made, Chee Lip Gan, Chengkuo Lee, Li Ling Yan, Aibin Yu, Seung Wook Yoon, and John H. Lau "Study of Ag-In solder as low temperature wafer bonding intermediate layer", Proc. SPIE 6884, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII, 68840H (20 February 2008); https://doi.org/10.1117/12.762046

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available