Paper
5 May 2008 Challenges and innovations in very-large CCD and CMOS imagers for professional imaging
Jan T. Bosiers, Holger Stoldt, Wilco Klaassens, Bart Dillen, Inge Peters, Erik Bogaart, Raymond Frost, Laurens Korthout, Jurgen Timpert
Author Affiliations +
Abstract
This paper presents an overview of the specific challenges that need to be overcome to make very-large CCD and CMOS imagers, and presents some recent innovations in this area. The complete development chain is described: research, production and industrialization. It will be shown that by innovative design and technology concepts, high-quality very large area CCD and CMOS imagers can be made, even up to wafer size (6" for CCD, 8" for CMOS).
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jan T. Bosiers, Holger Stoldt, Wilco Klaassens, Bart Dillen, Inge Peters, Erik Bogaart, Raymond Frost, Laurens Korthout, and Jurgen Timpert "Challenges and innovations in very-large CCD and CMOS imagers for professional imaging", Proc. SPIE 6996, Silicon Photonics and Photonic Integrated Circuits, 69960Z (5 May 2008); https://doi.org/10.1117/12.785847
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CITATIONS
Cited by 5 scholarly publications.
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KEYWORDS
Imaging systems

Charge-coupled devices

Semiconducting wafers

Amplifiers

Sensors

CCD image sensors

Electrons

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