Paper
3 February 2009 Ultra-fine pitch individually addressable visible laser arrays for high speed digital printing applications
O. P. Kowalski, S. D. McDougall, B. C. Qiu, G. H. Masterton, M. L. Armstrong, S. Robertson, S. Caldecott, J. H. Marsh
Author Affiliations +
Abstract
An individually addressable visible semiconductor laser diode array with a 20 μm pitch is demonstrated that is highly suited for deployment in next-generation digital print systems. The array, operating at 660 nm, comprises 22 single mode lasers fabricated on a single GaInP/AlGaInP/GaAs substrate. The laser array is flip-chip bonded onto a patterned ceramic submount that enables the individual elements to be driven independently and is integrated into a 26-pin butterfly package. Arrays tested CW exhibit low threshold current (<20 mA per emitter), up to 50 mW output power per channel with a high slope efficiency (0.9 W/A) and a high characteristic temperature of over 100 K.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
O. P. Kowalski, S. D. McDougall, B. C. Qiu, G. H. Masterton, M. L. Armstrong, S. Robertson, S. Caldecott, and J. H. Marsh "Ultra-fine pitch individually addressable visible laser arrays for high speed digital printing applications", Proc. SPIE 7230, Novel In-Plane Semiconductor Lasers VIII, 72301J (3 February 2009); https://doi.org/10.1117/12.809088
Lens.org Logo
CITATIONS
Cited by 5 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Laser bonding

Scanning electron microscopy

Ceramics

Laser applications

Metals

Printing

Semiconductor lasers

Back to Top