Paper
30 December 2008 Optical link by using optical wiring method for reducing EMI
In-Kui Cho, Jong-Hwa Kwon, Sung-Woong Choi, Alexander Bondarik, Je-Hoon Yun, Chang-Joo Kim, Seung-Beom Ahn, Myung-Yung Jeong, Hyo Hoon Park
Author Affiliations +
Proceedings Volume 7268, Smart Structures, Devices, and Systems IV; 72680I (2008) https://doi.org/10.1117/12.810220
Event: SPIE Smart Materials, Nano- and Micro-Smart Systems, 2008, Melbourne, Australia
Abstract
A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx) for reducing EMI (electromagnetic interference). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy assembly. The key benefit of fiber optic link is the absence of electromagnetic interference (EMI) noise creation and susceptibility. This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the following steps: (i) forming a light source device, an optical detection device, and an optical transmission unit on a substrate (metal optical bench (MOB)); (ii) preparing a flexible optical transmission-connection medium (optical wiring link) to optically connect the light source device formed on the substrate with the optical detection device; and (iii) directly connecting one end of the surface-finished optical transmission connection medium with the light source device and the other end with the optical detection device. Electronic interconnections have uniquely electronic problems such as EMI, shorting, and ground loops. Since these problems only arise during transduction (electronics-to-optics or opticsto- electronics), the purely optical part and optical link(interconnection) is free of these problems. 1 An optical link system constructed with TRx modules was fabricated and the optical characteristics about data links and EMI levels were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust and cost-effective assembly for reducing EMI of inter-chip interconnect. We successfully achieved a 4.5 Gb/s data transmission rate without EMI problems.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
In-Kui Cho, Jong-Hwa Kwon, Sung-Woong Choi, Alexander Bondarik, Je-Hoon Yun, Chang-Joo Kim, Seung-Beom Ahn, Myung-Yung Jeong, and Hyo Hoon Park "Optical link by using optical wiring method for reducing EMI", Proc. SPIE 7268, Smart Structures, Devices, and Systems IV, 72680I (30 December 2008); https://doi.org/10.1117/12.810220
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KEYWORDS
Phase only filters

Electromagnetic coupling

Vertical cavity surface emitting lasers

Ultraviolet radiation

Metals

Light sources

Optical benches

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