A study of the photo acid generator material design for chemically amplified photoresists

Y. Utsumi; T. Seshimo; Y. Komuro; A. Kawaue; K. Ishiduka; K. Matsuzawa; Hideo Hada; J. Onodera

doi:10.1117/12.815190

1 April 2009 A study of the photo acid generator material design for chemically amplified photoresists

Y. Utsumi, T. Seshimo, Y. Komuro, A. Kawaue, K. Ishiduka, K. Matsuzawa, Hideo Hada, J. Onodera

Proceedings Volume 7273, Advances in Resist Materials and Processing Technology XXVI; 72732F (2009) https://doi.org/10.1117/12.815190
Event: SPIE Advanced Lithography, 2009, San Jose, California, United States

Abstract

In current optical lithography, resolution is required to reach for 45 nm half-pitch and a chemically amplified resist (CAR) is used for a wide variety of applications. For ArF lithography beyond the 45 nm half-pitch, it is important to control pattern quality. The molecular design of a photo acid generator (PAG) is very important in the study to control not only acid strength but also acid diffusion length. Various novel PAGs that have different characteristics were synthesized for resist performance improvement. Acid molecular size was determined by molecular orbital (MO) calculation, and the acid diffusion coefficients (D) of these PAGs were evaluated by a bilayer method. As a result, it was found that acid diffusion coefficient (D) could not be controlled simply by adjusting anion molecular size. It may be presumed that the molecular interaction between acid generated by the exposure and polymer matrix areas is one of the most important key factors for controlling acid diffusion.

Citation Download Citation

Y. Utsumi, T. Seshimo, Y. Komuro, A. Kawaue, K. Ishiduka, K. Matsuzawa, Hideo Hada, and J. Onodera "A study of the photo acid generator material design for chemically amplified photoresists", Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 72732F (1 April 2009); https://doi.org/10.1117/12.815190

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