Effect of several processing parameters on material removal ratio in the deliquescent polishing of KDP crystals

Feihu Zhang; Shaolong Guo; Yong Zhang; Dianrong Luan

doi:10.1117/12.830905

21 May 2009 Effect of several processing parameters on material removal ratio in the deliquescent polishing of KDP crystals

Feihu Zhang, Shaolong Guo, Yong Zhang, Dianrong Luan

Author Affiliations +

Proceedings Volume 7282, 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies; 728227 (2009) https://doi.org/10.1117/12.830905
Event: AOMATT 2008 - 4th International Symposium on Advanced Optical Manufacturing, 2008, Chengdu, Chengdu, China

Abstract

A new ultraprecision machining technology for potassium dihydrogen phosphate (KDP) crystals, deliquescent polishing technology for KDP crystals, which utilizes deliquescent effect for ultraprecision machining KDP crystals, is proposed. The principle and the advantages of technology are introduced. The deliquescent polishing procedure of KDP crystals is given. The deliquescent polishing experiments of KDP crystals are conducted, and the material removal ratios are calculated. Through the experiments, the effect of four processing parameters (velocity of polishing plate, velocity of drip, volume percentage of water in the deliquescent polishing fluid, polishing pressure) on material removal ratio in the deliquescent polishing of KDP crystals is researched. The plot of material removal ratio versus every processing parameter in the deliquescent polishing of KDP crystals is obtained, and the rules of material removal ratio in the deliquescent polishing of KDP crystals are reached.

Citation Download Citation

Feihu Zhang, Shaolong Guo, Yong Zhang, and Dianrong Luan "Effect of several processing parameters on material removal ratio in the deliquescent polishing of KDP crystals", Proc. SPIE 7282, 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 728227 (21 May 2009); https://doi.org/10.1117/12.830905

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