Measurement of elastic thermal stress in COB packaging structures

Fanxiu Chen; Xiaoyuan He

doi:10.1117/12.839039

24 August 2009 Measurement of elastic thermal stress in COB packaging structures

Fanxiu Chen, Xiaoyuan He

Proceedings Volume 7375, ICEM 2008: International Conference on Experimental Mechanics 2008; 73750W (2009) https://doi.org/10.1117/12.839039
Event: International Conference on Experimental Mechanics 2008 and Seventh Asian Conference on Experimental Mechanics, 2008, Nanjing, China

Abstract

Digital speckle correlation method (DSCM) is used to measure the thermomechanical coupling effect in COB packaging structures. During deformation, CCD camera is applied to capture the speckle patterns of CMOS chip at different temperature fields constantly. These speckle patterns would provide the deformation history of the sample. By analyzing the speckle patterns, the in-plane deformation of the CMOS chip is obtained. Based on the trigonometrical theory, outplane displacement can be obtained from in-plane displacement, and then the elastic thermal stress of the chip is evaluated when the application of the temperature field is repeated. Experiment results are compared with both the results of FEM simulation and the theoretical model. There results are agreed well and it can be proved that DSCM can successfully be applied to analyze the thermomechanical coupling effect. The theoretical model was also verified by result of FEM simulation and experiment testing. Experiment results provide an availability consult to the design of MEMS apparatus.

Citation Download Citation

Fanxiu Chen and Xiaoyuan He "Measurement of elastic thermal stress in COB packaging structures", Proc. SPIE 7375, ICEM 2008: International Conference on Experimental Mechanics 2008, 73750W (24 August 2009); https://doi.org/10.1117/12.839039

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