Paper
16 February 2010 Power and speed analysis of miniaturized SOI y-branch Mach-Zehnder thermo-optic switches
K. P. Yap, T. Smy, J. H. Schmid, P. Waldron, A. Densmore, B. Syrett, S. Janz
Author Affiliations +
Proceedings Volume 7606, Silicon Photonics V; 76060P (2010) https://doi.org/10.1117/12.842737
Event: SPIE OPTO, 2010, San Francisco, California, United States
Abstract
We calculate the π-power and rise time for several 1×1 y-branch MZI SOI thermo-optic switches as a function of device size. These switches consist of waveguide core thickness ranging from 10 to 0.22 μm. Upon scaling the core thickness, the best power and speed performance occurs at 0.7 μm. Further miniaturization results in an increased power and reduced speed, mainly due to the mode expansion from the core into the cladding. We show that varying the MZI arm separation is an effective approach to improve the performance of miniaturized thermo-optic switches.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
K. P. Yap, T. Smy, J. H. Schmid, P. Waldron, A. Densmore, B. Syrett, and S. Janz "Power and speed analysis of miniaturized SOI y-branch Mach-Zehnder thermo-optic switches", Proc. SPIE 7606, Silicon Photonics V, 76060P (16 February 2010); https://doi.org/10.1117/12.842737
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Cited by 1 scholarly publication and 1 patent.
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KEYWORDS
Waveguides

Switches

Cladding

Thermal optics

Silicon

Channel waveguides

Oxides

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