Development of the second generation Hyperspectral Airborne Terrestrial Imager (HATI): HATI - 2500

S. Sandor-Leahy; S. Thordarson; B. Baldauf; M. Figueroa; M. Helmlinger; H. Miller; T. Reynolds; J. Shepanski

doi:10.1117/12.873006

26 August 2010 Development of the second generation Hyperspectral Airborne Terrestrial Imager (HATI): HATI - 2500

S. Sandor-Leahy, S. Thordarson, B. Baldauf, M. Figueroa, M. Helmlinger, H. Miller, T. Reynolds, J. Shepanski

Proceedings Volume 7813, Remote Sensing System Engineering III; 78130A (2010) https://doi.org/10.1117/12.873006
Event: SPIE Optical Engineering + Applications, 2010, San Diego, California, United States

Abstract

Northrop Grumman Aerospace Systems (NGAS) has a long legacy developing and fielding hyperspectral sensors, including airborne and space based systems covering the visible through Long Wave Infrared (LWIR) wavelength ranges. Most recently NGAS has developed the Hyperspectral Airborne Terrestrial Instrument (HATI) family of hyperspectral sensors, which are compact airborne hyperspectral imagers designed to fly on a variety of platforms and be integrated with other sensors in NGAS's instrument suite. The current sensor under development is the HATI-2500, a full range Visible Near Infrared (VNIR) through Short Wave Infrared (SWIR) instrument covering the 0.4 - 2.5 micron wavelength range with high spectral resolution (3nm). The system includes a framing camera integrated with a GPS/INS to provide high-resolution multispectral imagery and precision geolocation. Its compact size and flexible acquisition parameters allow HATI-2500 to be integrated on a large variety of aerial platforms. This paper describes the HATI-2500 sensor and subsystems and its expected performance specifications.

Citation Download Citation

S. Sandor-Leahy, S. Thordarson, B. Baldauf, M. Figueroa, M. Helmlinger, H. Miller, T. Reynolds, and J. Shepanski "Development of the second generation Hyperspectral Airborne Terrestrial Imager (HATI): HATI - 2500", Proc. SPIE 7813, Remote Sensing System Engineering III, 78130A (26 August 2010); https://doi.org/10.1117/12.873006

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