Highly precise and robust packaging of optical components

Michael Leers; Matthias Winzen; Erik Liermann; Heinrich Faidel; Thomas Westphalen; Jörn Miesner; Jörg Luttmann; Dieter Hoffmann

doi:10.1117/12.920016

22 February 2012 Highly precise and robust packaging of optical components

Michael Leers, Matthias Winzen, Erik Liermann, Heinrich Faidel, Thomas Westphalen, Jörn Miesner, Jörg Luttmann, Dieter Hoffmann

Author Affiliations +

Proceedings Volume 8244, Laser-based Micro- and Nanopackaging and Assembly VI; 824404 (2012) https://doi.org/10.1117/12.920016
Event: SPIE LASE, 2012, San Francisco, California, United States

Abstract

In this paper we present the development of a compact, thermo-optically stable and vibration and mechanical shock resistant mounting technique by soldering of optical components. Based on this technique a new generation of laser sources for aerospace applications is designed. In these laser systems solder technique replaces the glued and bolted connections between optical component, mount and base plate. Alignment precision in the arc second range and realization of long term stability of every single part in the laser system is the main challenge. At the Fraunhofer Institute for Laser Technology ILT a soldering and mounting technique has been developed for high precision packaging. The specified environmental boundary conditions (e.g. a temperature range of -40 °C to +50 °C) and the required degrees of freedom for the alignment of the components have been taken into account for this technique. In general the advantage of soldering compared to gluing is that there is no outgassing. In addition no flux is needed in our special process. The joining process allows multiple alignments by remelting the solder. The alignment is done in the liquid phase of the solder by a 6 axis manipulator with a step width in the nm range and a tilt in the arc second range. In a next step the optical components have to pass the environmental tests. The total misalignment of the component to its adapter after the thermal cycle tests is less than 10 arc seconds. The mechanical stability tests regarding shear, vibration and shock behavior are well within the requirements.

Citation Download Citation

Michael Leers, Matthias Winzen, Erik Liermann, Heinrich Faidel, Thomas Westphalen, Jörn Miesner, Jörg Luttmann, and Dieter Hoffmann "Highly precise and robust packaging of optical components", Proc. SPIE 8244, Laser-based Micro- and Nanopackaging and Assembly VI, 824404 (22 February 2012); https://doi.org/10.1117/12.920016

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available