Paper
27 February 2013 Optical transceivers for interconnections in satellite payloads
Mikko Karppinen, Veli Heikkinen, Eveliina Juntunen, Kari Kautio, Jyrki Ollila, Aila Sitomaniemi, Antti Tanskanen
Author Affiliations +
Proceedings Volume 8630, Optoelectronic Interconnects XIII; 86300F (2013) https://doi.org/10.1117/12.2009092
Event: SPIE OPTO, 2013, San Francisco, California, United States
Abstract
The increasing data rates and processing on board satellites call for the use of photonic interconnects providing high-bitrate performance as well as valuable savings in mass and volume. Therefore, optical transmitter and receiver technology is developed for aerospace applications. The metal-ceramic-packaging with hermetic fiber pigtails enables robustness for the harsh spacecraft environment, while the 850-nm VCSEL-based transceiver technology meets the high bit-rate and low power requirements. The developed components include 6 Gbps SpaceFibre duplex transceivers for intra-satellite data links and 40 Gbps parallel optical transceivers for board-to-board interconnects. Also, integration concept of interchip optical interconnects for onboard processor ICs is presented.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mikko Karppinen, Veli Heikkinen, Eveliina Juntunen, Kari Kautio, Jyrki Ollila, Aila Sitomaniemi, and Antti Tanskanen "Optical transceivers for interconnections in satellite payloads", Proc. SPIE 8630, Optoelectronic Interconnects XIII, 86300F (27 February 2013); https://doi.org/10.1117/12.2009092
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Cited by 2 scholarly publications.
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KEYWORDS
Transceivers

Satellites

Vertical cavity surface emitting lasers

Optical interconnects

Data communications

Fiber optics

Packaging

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