Study of swelling behavior in ArF resist during development by the QCM method (3): observations of swelling layer elastic modulus

Atsushi Sekiguchi

doi:10.1117/12.2006027

29 March 2013 Study of swelling behavior in ArF resist during development by the QCM method (3): observations of swelling layer elastic modulus

Atsushi Sekiguchi

Author Affiliations +

Proceedings Volume 8682, Advances in Resist Materials and Processing Technology XXX; 86821L (2013) https://doi.org/10.1117/12.2006027
Event: SPIE Advanced Lithography, 2013, San Jose, California, United States

Abstract

The QCM method allows measurements of impedance, an index of swelling layer viscosity in a photoresist during development. While impedance is sometimes used as a qualitative index of change in the viscosity of the swelling layer, it has to date not been used quantitatively, for data analysis. We explored a method for converting impedance values to elastic modulus (Pa), a coefficient expressing viscosity. Applying this method, we compared changes in the viscosity of the swelling layer in an ArF resist generated during development in a TMAH developing solution and in a TBAH developing solution. This paper reports the results of this comparative study.

Citation Download Citation

Atsushi Sekiguchi "Study of swelling behavior in ArF resist during development by the QCM method (3): observations of swelling layer elastic modulus", Proc. SPIE 8682, Advances in Resist Materials and Processing Technology XXX, 86821L (29 March 2013); https://doi.org/10.1117/12.2006027

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