Paper
19 April 2013 A dual mode imaging array for damage detection in grout structures
Author Affiliations +
Abstract
Due to the heterogeneous nature of the cement-based materials, the ultrasonic waves in concrete exhibit highly scattering and attenuation, leading to the difficulty of concrete damaged detection. This paper presents a dual mode ultrasonic array imaging methodology that can map damage using Rayleigh surface waves and permanently installed piezoelectric sensors. The dual mode sensing integrates passive acoustic emission and active ultrasonic wave inspection. When a crack is developing, acoustic emission (AE) occurs and the disturbance can propagate outwards along the structure surface. A novel AE source imaging algorithm has been developed to detect and locate the AE source. Once the AE source is located, the sensor array switches to its active mode. For active sensing, one sensor in the array is used to generate Rayleigh wave for interrogation, while all the others are used as the wave receivers. All the sensory data are processed by the active ultrasonic array imaging algorithm. The proof-of-concept testing was performed on a grout specimen with representative dimensions. The passive array imaging algorithm was able to locate the AE source simulated by pencil lead break while active sensing imaging was able to detect the damage simulated by a hole. The duel mode imaging method is promising and economically beneficial for solving a key source localization problem in damage detection on large concrete structures.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zhenhua Tian, Lingyu Yu, Mohamed EL-Batanouny, Paul Ziehl, and Liuxian Zhao "A dual mode imaging array for damage detection in grout structures", Proc. SPIE 8692, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2013, 86920D (19 April 2013); https://doi.org/10.1117/12.2009751
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Cited by 1 scholarly publication.
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KEYWORDS
Sensors

Imaging arrays

Ferroelectric materials

Active remote sensing

Ultrasonics

Semiconducting wafers

Damage detection

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