Subsurface damage detection and damage mechanism analysis of chemical-mechanical polished optics

Hui Ye; Wei Yang; Guo Bi; Ping Yang; Yinbiao Guo

doi:10.1117/12.2069273

18 September 2014 Subsurface damage detection and damage mechanism analysis of chemical-mechanical polished optics

Hui Ye, Wei Yang, Guo Bi, Ping Yang, Yinbiao Guo

Proceedings Volume 9282, 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment; 928203 (2014) https://doi.org/10.1117/12.2069273
Event: 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT 2014), 2014, Harbin, China

Abstract

Detection of the subsurface damage depth in optical elements has significance on the subsequent material removal amount and improving element surface quality. The paper focuses on the subsurface damage of chemical-mechanical polished K9 specimen, and analyses the chemical-mechanical polishing mechanism and the cause of subsurface damage. A most suitable etchant is chosen and the step-by-step etching method is applied to measure the subsurface damage depth. A microscope is used to detect the damage morphology and the variation trend at different depth. Research shows that the subsurface damage caused by chemical-mechanical polishing is Hertz scratch, and the scratch quantity below surface presents a variation of zero-more-less-disappeared. The K9 specimen is polished for 3 min under the pressure of 2.5 Kgf and the spindle speed of 43139 r/min, thus resulting in a subsurface damage depth 15.3μm.

Citation Download Citation

Hui Ye, Wei Yang, Guo Bi, Ping Yang, and Yinbiao Guo "Subsurface damage detection and damage mechanism analysis of chemical-mechanical polished optics", Proc. SPIE 9282, 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment, 928203 (18 September 2014); https://doi.org/10.1117/12.2069273

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