Development of an ultra-high temperature infrared scene projector at Santa Barbara Infrared Inc.

Greg Franks; Joe Laveigne; Tom Danielson; Steve McHugh; John Lannon Jr.; Scott Goodwin

doi:10.1117/12.2177448

12 May 2015 Development of an ultra-high temperature infrared scene projector at Santa Barbara Infrared Inc.

Greg Franks, Joe Laveigne, Tom Danielson, Steve McHugh, John Lannon Jr., Scott Goodwin

Author Affiliations +

Proceedings Volume 9452, Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXVI; 94520W (2015) https://doi.org/10.1117/12.2177448
Event: SPIE Defense + Security, 2015, Baltimore, MD, United States

Abstract

The rapid development of very-large format infrared detector arrays has challenged the IR scene projector community to develop correspondingly larger-format infrared emitter arrays to support the testing needs of systems incorporating these detectors. As with most integrated circuits, fabrication yields for the read-in integrated circuit (RIIC) that drives the emitter pixel array are expected to drop dramatically with increasing size, making monolithic RIICs larger than the current 1024x1024 format impractical and unaffordable. Additionally, many scene projector users require much higher simulated temperatures than current technology can generate to fully evaluate the performance of their systems and associated processing algorithms. Under the Ultra High Temperature (UHT) development program, Santa Barbara Infrared Inc. (SBIR) is developing a new infrared scene projector architecture capable of producing both very large format (>1024x1024) resistive emitter arrays and improved emitter pixel technology capable of simulating very high apparent temperatures. During an earlier phase of the program, SBIR demonstrated materials with MWIR apparent temperatures in excess of 1000K. New emitter materials have subsequently been selected to produce pixels that achieve even higher apparent temperatures. Test results from pixels fabricated using the new material set will be presented and discussed. Also in development under the same UHT program is a 'scalable' RIIC that will be used to drive the high temperature pixels. This RIIC will utilize through-silicon vias (TSVs) and quilt packaging (QP) technologies to allow seamless tiling of multiple chips to fabricate very large arrays, and thus overcome the inherent yield limitations of very-large-scale integrated circuits. Current status of the RIIC development effort will also be presented.

Citation Download Citation

Greg Franks, Joe Laveigne, Tom Danielson, Steve McHugh, John Lannon Jr., and Scott Goodwin "Development of an ultra-high temperature infrared scene projector at Santa Barbara Infrared Inc.", Proc. SPIE 9452, Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXVI, 94520W (12 May 2015); https://doi.org/10.1117/12.2177448

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