Optimum design and experimental verification of glue bonding area and thickness for an eight-inch reflective mirror

Chia-Yen Chan; Yi-Cheng Chen; Ting-Ming Huang

doi:10.1117/12.2236128

27 September 2016 Optimum design and experimental verification of glue bonding area and thickness for an eight-inch reflective mirror

Chia-Yen Chan, Yi-Cheng Chen, Ting-Ming Huang

Author Affiliations +

Proceedings Volume 9953, Optical Modeling and Performance Predictions VIII; 99530J (2016) https://doi.org/10.1117/12.2236128
Event: SPIE Optical Engineering + Applications, 2016, San Diego, California, United States

Abstract

Effects of glue bonding area and bonding thickness on an eight-inch BOROFLOAT® reflective mirror have been studied numerically and experimentally. The comparison of optical aberrations under the self-weight loading and temperature difference has also been investigated. RTV566 has been selected to bond the mirror with on a ring support mount. The optimum glue bonding area and bonding thickness for isolating the temperature variation have been obtained through a design optimization process and then been used practically. A laser interferometer with a wavelength of 632.8 nm has been used to observe the optical path difference pattern and aberrations. The influence of ambient temperature on the mirror with the optimum glue bonding area and thickness has been carried out. It is concluded that the optimum design of the glue for isolating the temperature variation has been attained numerically and verified successfully with the experimental observations.

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Chia-Yen Chan, Yi-Cheng Chen, and Ting-Ming Huang "Optimum design and experimental verification of glue bonding area and thickness for an eight-inch reflective mirror", Proc. SPIE 9953, Optical Modeling and Performance Predictions VIII, 99530J (27 September 2016); https://doi.org/10.1117/12.2236128

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KEYWORDS

Mirrors

Photovoltaics

Wavefronts

Reflectivity

Temperature metrology

Finite element methods

Mirror mounts

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