PIXAPP: the photonics packaging pilot line

Padraic E. Morrissey

doi:10.1117/12.2631224

30 May 2022 PIXAPP: the photonics packaging pilot line

Padraic E. Morrissey

Proceedings Volume PC12148, Integrated Photonics Platforms II; PC1214809 (2022) https://doi.org/10.1117/12.2631224
Event: SPIE Photonics Europe, 2022, Strasbourg, France

Abstract

PIXAPP, the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line provides companies with standardised packaging solutions along the entire supply chain for prototyping and pilot-scale production.

Conference Presentation

Citation Download Citation

Padraic E. Morrissey "PIXAPP: the photonics packaging pilot line", Proc. SPIE PC12148, Integrated Photonics Platforms II, PC1214809 (30 May 2022); https://doi.org/10.1117/12.2631224

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