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3 October 2022 New approaches to metallic nanogap sensors and devices (Conference Presentation)
John C. de Mello, Sihai Luo
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Proceedings Volume PC12210, Organic and Hybrid Sensors and Bioelectronics XV; PC122100E (2022) https://doi.org/10.1117/12.2633791
Event: SPIE Organic Photonics + Electronics, 2022, San Diego, California, United States
Abstract
Metallic nanogaps are fundamental components of nanoscale photonic and electronic devices. However, the lack of reproducible, high-yield fabrication methods with nanometric control over the gap-size is hindering practical applications. In this presentation, I will describe a novel technique called adhesion lithography that permits the rapid fabrication of nanogap electrodes, with electrode spacings as low as 3 nm. The procedure—which can be carried out at room temperature under ambient conditions, using simple equipment and only a few processing steps—provides a rapid and well-controlled route to a wide range of nanogap devices. I will describe how the basic technique may be combined with other lithographic methods to create large-area (> 1 cm2) arrays that contain hundreds of millions of size-controlled metallic nanogaps, and will give selected examples of how the resulting arrays may be applied in the fields of molecular electronics, plasmonics and biosensing.
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John C. de Mello and Sihai Luo "New approaches to metallic nanogap sensors and devices (Conference Presentation)", Proc. SPIE PC12210, Organic and Hybrid Sensors and Bioelectronics XV, PC122100E (3 October 2022); https://doi.org/10.1117/12.2633791
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KEYWORDS
Sensors
Electrodes
Lithography
Nanolithography
Electronic components
Fabrication
Molecular electronics
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