Intracomputer optical interconnects: progress and challenges

Julian Bristow

doi:10.1117/12.229268

30 January 1996 Intracomputer optical interconnects: progress and challenges

Julian Bristow

Proceedings Volume 10284, Optoelectronic Interconnects and Packaging: A Critical Review; 102840H (1996) https://doi.org/10.1117/12.229268
Event: Photonics West '96, 1996, San Jose, CA, United States

Abstract

Several interconnect Junctions within cabinets comprising high performance computers are pushing the limits of electrical interconnect technology. A widespread problem of limited interconnect density at the board-to-backplane interface has been identified, while advances in clock speed and cabinet functionality are expected to stress electrical interconnects first for high fanout applications, then for high speed point-to-point parallel interconnects. Key components are described, and from these components the design of a generic optical backplane technology is described. While components are now available to implement a practical solution, the use of proven electrical techniques is considered an important step in hastening the introduction of the technology.

Citation Download Citation

Julian Bristow "Intracomputer optical interconnects: progress and challenges", Proc. SPIE 10284, Optoelectronic Interconnects and Packaging: A Critical Review, 102840H (30 January 1996); https://doi.org/10.1117/12.229268

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