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17 November 2017 A platform for European CMOS image sensors for space applications
K. Minoglou, D. San Segundo Bello, D. Sabuncuoglu Tezcan, L. Haspeslagh, J. Van Olmen, B. Merry, C. Cavaco, F. Mazzamuto, I. Toqué-Trésonne, R. Moirin, M. Brouwer, M. Toccafondi, G. Preti, M. Rosmeulen, P. De Moor
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Proceedings Volume 10563, International Conference on Space Optics — ICSO 2014; 1056304 (2017) https://doi.org/10.1117/12.2304233
Event: International Conference on Space Optics — ICSO 2014, 2014, Tenerife, Canary Islands, Spain
Abstract
Both ESA and the EC have identified the need for a supply chain of CMOS imagers for space applications which uses solely European sources. An essential requirement on this supply chain is the platformization of the process modules, in particular when it comes to very specific processing steps, such as those required for the manufacturing of backside illuminated image sensors. This is the goal of the European (EC/FP7/SPACE) funded project EUROCIS. All EUROCIS partners have excellent know-how and track record in the expertise fields required. Imec has been leading the imager chip design and the front side and backside processing. LASSE, as a major player in the laser annealing supplier sector, has been focusing on the optimization of the process related to the backside passivation of the image sensors. TNO, known worldwide as a top developer of instruments for scientific research, including space research and sensors for satellites, has contributed in the domain of optical layers for space instruments and optimized antireflective coatings. Finally, Selex ES, as a world-wide leader for manufacturing instruments with expertise in various space missions and programs, has defined the image sensor specifications and is taking care of the final device characterization. In this paper, an overview of the process flow, the results on test structures and imagers processed using this platform will be presented.
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K. Minoglou, D. San Segundo Bello, D. Sabuncuoglu Tezcan, L. Haspeslagh, J. Van Olmen, B. Merry, C. Cavaco, F. Mazzamuto, I. Toqué-Trésonne, R. Moirin, M. Brouwer, M. Toccafondi, G. Preti, M. Rosmeulen, and P. De Moor "A platform for European CMOS image sensors for space applications", Proc. SPIE 10563, International Conference on Space Optics — ICSO 2014, 1056304 (17 November 2017); https://doi.org/10.1117/12.2304233
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KEYWORDS
Semiconducting wafers
Silicon
Antireflective coatings
Image processing
Imaging systems
Annealing
Analog electronics
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