CONFERENCE PROCEEDINGS
Advanced Search
Home > Proceedings > Volume 11267 > Article
Presentation
9 March 2020 Single and dual wavelength double fs-pulse laser irradiation for transparent material processing (Conference Presentation)
John Lopez, Kevin Gaudfrin, Konstantin Mishchik, Martin Delaigue, Clemens Hönninger, Eric Audouard, Rainer Kling, Guillaume Duchateau
Author Affiliations +
Proceedings Volume 11267, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV; 1126716 (2020) https://doi.org/10.1117/12.2544323
Event: SPIE LASE, 2020, San Francisco, California, United States
Abstract
Ultrafast laser glass processing is highly interesting for microelectronics and consumer electronics industries. Indeed, ultrafast laser technology has the unique capacity to produce a high-quality surface or bulk modification in dielectric transparent materials thank to nonlinear absorption. However, there is a need to improve both processing quality and throughput in order to meet the industry requirements. Beam shaping, performed by tuning spatial or temporal intensity profile, polarization, fluence, or any other laser parameters, is a smart and flexible technique to achieve this goal. This work is dealing with double fs-pulse laser irradiation of fused silica. Our purpose is to investigate the benefits and the drawbacks in using single and dual-wavelength double fs-pulse laser irradiation of fused silica. The influence of pulse-to-pulse delay (0 to 5 ps), pulse duration of the second pulse (1 ps to 25 ns) and fluence on both removal rate and optical transmission will be discussed.
Conference Presentation
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation Download Citation
John Lopez, Kevin Gaudfrin, Konstantin Mishchik, Martin Delaigue, Clemens Hönninger, Eric Audouard, Rainer Kling, and Guillaume Duchateau "Single and dual wavelength double fs-pulse laser irradiation for transparent material processing (Conference Presentation)", Proc. SPIE 11267, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV, 1126716 (9 March 2020); https://doi.org/10.1117/12.2544323
ACCESS THE FULL ARTICLE
ORGANIZATIONAL
Sign in with credentials provided by your organization.
INSTITUTIONAL
Select your institution to access the SPIE Digital Library.
SELECT YOUR INSTITUTION
PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
PERSONAL SIGN IN
No SPIE Account? Create one
PURCHASE THIS CONTENT
SUBSCRIBE TO DIGITAL LIBRARY
50 downloads per 1-year subscription
Members: $195
Non-members: $335 ADD TO CART
25 downloads per 1 - year subscription
Members: $145
Non-members: $250 ADD TO CART
PURCHASE SINGLE ARTICLE
Includes PDF, HTML & Video, when available
Members: $17.00
Non-members: $21.00 ADD TO CART
PROCEEDINGS
 PRESENTATION
WATCH
PRESENTATION SAVE TO MY LIBRARY
GET CITATION
Advertisement
Advertisement
KEYWORDS
Laser irradiation
Materials processing
Picosecond phenomena
Silica
Ultrafast lasers
Consumer electronics
Dielectrics
RELATED CONTENT
Subscribe to Digital Library
Receive Erratum Email Alert
Back to Top