Wafer-scale integration of antimonide-based MWIR FPAs

Alex Gurga; Yan Tang; Sevag Terterian; Mary Chen; Diego Carrasco; James Jenkins; Shuoqin Wang; Terry De Lyon; Choukri Allali; Allen Hollingsworth; J.-P. Curzan; John Caulfield; Nishant Dhawan; William Z. Korth; Binh-Minh Nguyen

doi:10.1117/12.2588311

12 April 2021 Wafer-scale integration of antimonide-based MWIR FPAs

Alex Gurga, Yan Tang, Sevag Terterian, Mary Chen, Diego Carrasco, James Jenkins, Shuoqin Wang, Terry De Lyon, Choukri Allali, Allen Hollingsworth, J.-P. Curzan, John Caulfield, Nishant Dhawan, William Z. Korth, Binh-Minh Nguyen

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Proceedings Volume 11741, Infrared Technology and Applications XLVII; 1174110 (2021) https://doi.org/10.1117/12.2588311
Event: SPIE Defense + Commercial Sensing, 2021, Online Only

Abstract

High performance infrared focal plane arrays (FPAs) play a critical role in a wide range of imaging applications. However the high cost associated with the required cooling and serially processed die-level hybridization is major barrier that has thwarted Mid-wavelength Infrared (MWIR) detector technology from penetrating largevolume, low-cost markets. Under the Defense Advanced Research Projects Agency (DARPA) WIRED program, the HRL team has developed a wafer level integration schemes to fabricate large format Antimonidebased MWIR FPAs on Si Read Out Integrated Circuit (ROIC) as a means to achieve significant fab cost reduction and enhanced production scalability. The DARPA-hard challenge we are addressing is the thermal and stress management in the integration of two dissimilar materials to avoid detector and ROIC degradation and to maintain structure integrity at the wafer scale. In addition, a digital ROIC with extremely large well capacity was designed and taped-out, in order to increase the operating temperature of the FPAs. In this talk, we discuss our progress under the DARPA WIRED program.

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Alex Gurga, Yan Tang, Sevag Terterian, Mary Chen, Diego Carrasco, James Jenkins, Shuoqin Wang, Terry De Lyon, Choukri Allali, Allen Hollingsworth, J.-P. Curzan, John Caulfield, Nishant Dhawan, William Z. Korth, and Binh-Minh Nguyen "Wafer-scale integration of antimonide-based MWIR FPAs", Proc. SPIE 11741, Infrared Technology and Applications XLVII, 1174110 (12 April 2021); https://doi.org/10.1117/12.2588311

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