Presentation + Paper
26 May 2022 High-transmission EUV pellicles supporting >400W source power
Mark van de Kerkhof, Alexander Klein, Paul Vermeulen, Ties van der Woord, Inci Donmez, Guido Salmaso, Raymond Maas
Author Affiliations +
Abstract
EUV lithography has been adopted worldwide for High-Volume Manufacturing (HVM) of sub-10nm node semiconductors. To support HVM, EUV pellicles were introduced by ASML in 2016, and more recently, pellicles made from novel materials were developed to offer higher transmission and support higher source powers. In this paper, we will give an overview of current EUV pellicles. Also, we will report on our continuing research to optimize EUV pellicles to transmissions of above 90%, and supporting EUV source powers of above 400W. Key performance indicators of such novel pellicles will be presented, showing the promise of these materials to support upcoming lithography nodes.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mark van de Kerkhof, Alexander Klein, Paul Vermeulen, Ties van der Woord, Inci Donmez, Guido Salmaso, and Raymond Maas "High-transmission EUV pellicles supporting >400W source power", Proc. SPIE 12051, Optical and EUV Nanolithography XXXV, 120510B (26 May 2022); https://doi.org/10.1117/12.2614262
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KEYWORDS
Pellicles

Extreme ultraviolet

Scanners

Composites

Extreme ultraviolet lithography

Metals

Semiconducting wafers

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