System-level evaluation of 3D power delivery network at 2nm node

Giuliano Sisto; Rongmei Chen; Dragomir Milojevic; Odysseas Zografos; Pieter Weckx; Geert Hellings; Julien Ryckaert

doi:10.1117/12.2656469

28 April 2023 System-level evaluation of 3D power delivery network at 2nm node

Giuliano Sisto, Rongmei Chen, Dragomir Milojevic, Odysseas Zografos, Pieter Weckx, Geert Hellings, Julien Ryckaert

Proceedings Volume 12495, DTCO and Computational Patterning II; 124950Y (2023) https://doi.org/10.1117/12.2656469
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

Fine-pitch 3D integration is considered a promising way to advance traditional CMOS scaling as 3D interconnects are currently capable to match the connectivity among functional sub-blocks of a system, enabling their displacement on different tiers. A major bottleneck for 3D ICs is represented by the power delivery, due to the challenge of supplying multiple dies. This work aims to provide insights into the system-level impact of PDN in a 3D chip, in terms of frequency and IR drop. A highly-interconnected memory-dominated SoC is physically implemented using the same 2nm technology in 2D and 3D. For both options, the results are compared with an ideal PDN-less implementation, showing that 3D-induced frequency (up to 9.3%) and wirelength (∼ 10%) benefits are retained upon PDN insertion. From the power integrity perspective, a ∼ 60mV dynamic IR drop improvement is observed in 3D, compared to a conventional frontside PDN in 2D, when considering the 90th percentile of a cumulative distribution function. This work validates the expected technology-driven benefits of 3D integration at the system physical design level, in a realistic environment including a 3D PDN.

Conference Presentation

Citation Download Citation

Giuliano Sisto, Rongmei Chen, Dragomir Milojevic, Odysseas Zografos, Pieter Weckx, Geert Hellings, and Julien Ryckaert "System-level evaluation of 3D power delivery network at 2nm node", Proc. SPIE 12495, DTCO and Computational Patterning II, 124950Y (28 April 2023); https://doi.org/10.1117/12.2656469

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