From micro to nano, and beyond: measuring innovations

Zhigang Wang; Byoungho Lee

doi:10.1117/12.2664258

30 April 2023 From micro to nano, and beyond: measuring innovations

Zhigang Wang, Byoungho Lee

Proceedings Volume 12496, Metrology, Inspection, and Process Control XXXVII; 1249604 (2023) https://doi.org/10.1117/12.2664258
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

Seeing an increasingly critical role of MI in the semiconductor industry, in this keynote, we will first review the evolution of the MI technologies in the last few decades, and then discuss the challenges we are presently engaging in, focusing on the EUV era metrology topics: thin resist, 3D and massive measurement. Most importantly, as an obligation of one of the leading equipment suppliers in this field, we will present a vision for the future technologies, in response to the keynotes from the device makers in recent years, mainly focus on electron beam tools but also to cover a certain range of different field technologies.

Conference Presentation

Citation Download Citation

Zhigang Wang and Byoungho Lee "From micro to nano, and beyond: measuring innovations", Proc. SPIE 12496, Metrology, Inspection, and Process Control XXXVII, 1249604 (30 April 2023); https://doi.org/10.1117/12.2664258

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available