YOLOv8 for defect inspection of hexagonal directed self-assembly patterns: a data-centric approach

Enrique Dehaerne; Bappaditya Dey; Hossein Esfandiar; Lander Verstraete; Hyo Seon Suh; Sandip Halder; Stefan De Gendt

doi:10.1117/12.2675573

5 October 2023 YOLOv8 for defect inspection of hexagonal directed self-assembly patterns: a data-centric approach

Enrique Dehaerne, Bappaditya Dey, Hossein Esfandiar, Lander Verstraete, Hyo Seon Suh, Sandip Halder, Stefan De Gendt

Proceedings Volume 12802, 38th European Mask and Lithography Conference (EMLC 2023); 128020S (2023) https://doi.org/10.1117/12.2675573
Event: 38th European Mask and Lithography Conference, 2023, Dresden, Germany

Abstract

Shrinking pattern dimensions leads to an increased variety of defect types in semiconductor devices. This has spurred innovation in patterning approaches such as Directed Self-Assembly (DSA) for which no traditional, automatic defect inspection software exists. Machine Learning-based SEM image analysis has become an increasingly popular research topic for defect inspection with supervised ML models often showing the best performance. However, little research has been done on obtaining a dataset with high-quality labels for these supervised models. In this work, we propose a method for obtaining coherent and complete labels for a dataset of hexagonal contact hole DSA patterns while requiring minimal quality control effort from a DSA expert. We show that YOLOv8, a state-of-the-art neural network, achieves defect detection precisions of more than 0.9 mAP on our final dataset which best reflects DSA expert defect labeling expectations. We discuss the strengths and limitations of our proposed labeling approach and suggest directions for future work in data-centric ML-based defect inspection.

Citation Download Citation

Enrique Dehaerne, Bappaditya Dey, Hossein Esfandiar, Lander Verstraete, Hyo Seon Suh, Sandip Halder, and Stefan De Gendt "YOLOv8 for defect inspection of hexagonal directed self-assembly patterns: a data-centric approach", Proc. SPIE 12802, 38th European Mask and Lithography Conference (EMLC 2023), 128020S (5 October 2023); https://doi.org/10.1117/12.2675573

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available