Non-destructive measurement of bottom width in deep trench isolation structures using IRCD metrology

Nick Keller; Marc Poulingue; Ross Grynko; Troy Ribaudo; G. Andrew Antonelli; Victor Li; Marcello Ravasio; Delphine Le Cunff

doi:10.1117/12.3010926

9 April 2024 Non-destructive measurement of bottom width in deep trench isolation structures using IRCD metrology

Nick Keller, Marc Poulingue, Ross Grynko, Troy Ribaudo, G. Andrew Antonelli, Victor Li, Marcello Ravasio, Delphine Le Cunff

Author Affiliations +

Proceedings Volume 12955, Metrology, Inspection, and Process Control XXXVIII; 1295514 (2024) https://doi.org/10.1117/12.3010926
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Abstract

As scaling in semiconductor devices continues, the aspect ratios of deep trench isolation (DTI) structures have increased. DTI structures are used in power devices, power management ICs and image sensors as a method to isolate active devices by reducing crosstalk, parasitic capacitance, latch-up and allowing for an increase breakdown voltage of active devices. Measurement of these structures in high volume manufacturing (HVM), with non-destructive technology, has mostly been limited to the depth and top width of the DTI structure, while the bottom width (BCD) has not been able to be reliably measured. Here we present two different optical metrologies, “conventional” OCD and IRCD, that operate in the UV-VIS-NIR and MIR region of the electromagnetic spectrum, respectively, and discuss the measurability of DTI sidewall profile, bottom width, and depth in BCD (Bipolar CMOS DMOS) power management IC devices for each method at various pitches and line to space ratios. Experimental data will be presented showing sensitivity and discrimination of IRCD to a DOE specifically on the bottom width for three different structures.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Nick Keller, Marc Poulingue, Ross Grynko, Troy Ribaudo, G. Andrew Antonelli, Victor Li, Marcello Ravasio, and Delphine Le Cunff "Non-destructive measurement of bottom width in deep trench isolation structures using IRCD metrology", Proc. SPIE 12955, Metrology, Inspection, and Process Control XXXVIII, 1295514 (9 April 2024); https://doi.org/10.1117/12.3010926

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