PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
A non-PFAS biomass EUV resist is proposed as a sustainable material for reducing PFAS and CO2 emissions. It was
demonstrated that HP 8nm L/S pattern formation with a non-PFAS biomass EUV resist for beyond 2nm node. Furthermore,
biomass developer and rinse for non-PFAS biomass EUV resists are proposed to improve biomass content. This proves
that the non-PFAS biomass EUV resist can be used in high-NA EUV lithography at 8nm.
Conference Presentation
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Kazuyo Morita
"Non-PFAS biomass EUV resist for sustainable semiconductor manufacturing", Proc. SPIE 12957, Advances in Patterning Materials and Processes XLI, 1295718 (9 April 2024); https://doi.org/10.1117/12.3010636
ACCESS THE FULL ARTICLE
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
The alert did not successfully save. Please try again later.
Kazuyo Morita, "Non-PFAS biomass EUV resist for sustainable semiconductor manufacturing," Proc. SPIE 12957, Advances in Patterning Materials and Processes XLI, 1295718 (9 April 2024); https://doi.org/10.1117/12.3010636