Presentation + Paper
18 June 2024 Thin-film lithium niobate PICs: advancements and potential applications in telecom and beyond
H. Sattari, I. Prieto, H. Zarebidaki, J. Leo, G. Choong, F. Arefi, M. Orvietani, A. Della Torre, A. Mettraux, F. Dubois, D. Herle, Y. Petremand, M. Palmieri, O. Dubochet, M. Despont
Author Affiliations +
Abstract
The emergent thin-film lithium niobate on insulator (TFLN or LNOI) photonic integrated circuits (PICs) offer significant advantages in various applications due to their unique properties. This paper briefly explores recent advancements in TFLN PIC developments and their broad applications, emphasizing transformative capabilities in telecommunications and beyond. We highlight CSEM's pioneering initiative in establishing the first open-access foundry for this technology, addressing challenges associated with limited access to manufacturing facilities and process design kits (PDK).
Conference Presentation
© (2024) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
H. Sattari, I. Prieto, H. Zarebidaki, J. Leo, G. Choong, F. Arefi, M. Orvietani, A. Della Torre, A. Mettraux, F. Dubois, D. Herle, Y. Petremand, M. Palmieri, O. Dubochet, and M. Despont "Thin-film lithium niobate PICs: advancements and potential applications in telecom and beyond", Proc. SPIE 13012, Integrated Photonics Platforms III, 130120H (18 June 2024); https://doi.org/10.1117/12.3026042
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KEYWORDS
Photonic integrated circuits

Manufacturing

Lithium niobate

Telecommunications

Thin films

Design

Quantum processes

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