Paper
10 December 2024 Multilayer reticle heating impact on product overlay
Author Affiliations +
Proceedings Volume 13423, Eighth International Workshop on Advanced Patterning Solutions (IWAPS 2024); 134230K (2024) https://doi.org/10.1117/12.3052900
Event: 8th International Workshop on Advanced Patterning Solutions (IWAPS 2024), 2024, Jiaxing, Zhejiang, China
Abstract
With the continuous resolution shrinking in cutting edge semiconductor industry such as memory device, on product overlay (OPO) control has become more and more challenging. Reticle heating is a critical impact to OPO when DUV light exposes to the reticle, as the thermal expansion of the reticle induces nanos of overlay error on wafer level which directly impacts device function. Reticle heating control functions has been developed to compensate overlay error in current advanced scanners for normal full reticle, of which one layer mask occupies one reticle. However, the heating effect of Multilayer Reticle (MLR), wherein one reticle consists of multiple mask layers, is less discussed. In this paper, we investigated the reticle heating effect to OPO on MLR, and the methods for MLR heating control is proposed.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Yuxing Zhou, Guangying Zhou, Mingyi Yao, Di Liang, Jiahao Xi, Ganlin Song, Xiuyan Cheng, Miao Jiang, and Jiangliu Shi "Multilayer reticle heating impact on product overlay", Proc. SPIE 13423, Eighth International Workshop on Advanced Patterning Solutions (IWAPS 2024), 134230K (10 December 2024); https://doi.org/10.1117/12.3052900
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KEYWORDS
Reticles

Semiconducting wafers

Overlay metrology

Lithography

Scanners

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