Profiling of multichip module interconnects with a hybrid high-speed triangulation range sensor

Shahzad F. Kirmani; Paul R. Haugen; David M. Kranz

doi:10.1117/12.145553

28 May 1993 Profiling of multichip module interconnects with a hybrid high-speed triangulation range sensor

Shahzad F. Kirmani, Paul R. Haugen, David M. Kranz

Proceedings Volume 1821, Industrial Applications of Optical Inspection, Metrology, and Sensing; (1993) https://doi.org/10.1117/12.145553
Event: Applications in Optical Science and Engineering, 1992, Boston, MA, United States

Abstract

To increase the functionality and complexity of microelectronic components, new packaging techniques such as multichip-modules (MCMs) are used. However, certain MCM manufacturing processes are limited by the yield and reliability of the electrical contacts formed by the solder interconnects or bumps. In this paper we describe an optical measurement system to detect defective electrical contacts before bonding occurs. By using a high-speed, laser-based point range sensor and a high speed part transport system, critical solder bump features such as volume, height and planarity can be measured.

Citation Download Citation

Shahzad F. Kirmani, Paul R. Haugen, and David M. Kranz "Profiling of multichip module interconnects with a hybrid high-speed triangulation range sensor", Proc. SPIE 1821, Industrial Applications of Optical Inspection, Metrology, and Sensing, (28 May 1993); https://doi.org/10.1117/12.145553

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