Reactive ion etching of microlens arrays into fused silica

Stefan Haselbeck; Martin Eisner; Horst Schreiber; Johannes Schwider

doi:10.1117/12.190220

12 October 1994 Reactive ion etching of microlens arrays into fused silica

Stefan Haselbeck, Martin Eisner, Horst Schreiber, Johannes Schwider

Proceedings Volume 2169, Nonconventional Optical Imaging Elements; (1994) https://doi.org/10.1117/12.190220
Event: International Colloquium on Nonconventional Optical Imaging Elements, 1993, Rydzyna-Rokosowo, Poland

Abstract

Microlens arrays made in photoresist can be transferred into fused silica substrates by reactive ion etching herby, the etch rates of resist and silica differ by a factor of up to 3 depending on the oxygen content of the reacting gases in the etching machine. The resulting lenses are tested for the surface quality with the help of a Mach- Zehnder interference microscope. Merit functions such as point spread function and modulation transfer function can be calculated from the measured wave aberration data.

Citation Download Citation

Stefan Haselbeck, Martin Eisner, Horst Schreiber, and Johannes Schwider "Reactive ion etching of microlens arrays into fused silica", Proc. SPIE 2169, Nonconventional Optical Imaging Elements, (12 October 1994); https://doi.org/10.1117/12.190220

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