Spectrophotometry and beam profile reflectometry measurement of six layers in an SOI film stack

JingMin Leng; John J. Sidorowich; Y. D. Yoon; Jon L. Opsal; B. H. Lee; Giho Cha; Joo-Tae Moon; Sang-In Lee

doi:10.1117/12.250935

13 September 1996 Spectrophotometry and beam profile reflectometry measurement of six layers in an SOI film stack

JingMin Leng, John J. Sidorowich, Y. D. Yoon, Jon L. Opsal, B. H. Lee, Giho Cha, Joo-Tae Moon, Sang-In Lee

Proceedings Volume 2877, Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing III; (1996) https://doi.org/10.1117/12.250935
Event: Microelectronic Manufacturing 1996, 1996, Austin, TX, United States

Abstract

We developed a robust measurement recipe for six layer SOI film stack. Both spectrometer and BPR were combined to characterize the plate and storage polysilicons. A new global optimization method was developed to find the best solution in parameter spaces with up to 12 parameters. Such a recipe was applied to production wafers with over 50 site die mapping. The 5 day repeatability shows the measurements were stable and robust.

Citation Download Citation

JingMin Leng, John J. Sidorowich, Y. D. Yoon, Jon L. Opsal, B. H. Lee, Giho Cha, Joo-Tae Moon, and Sang-In Lee "Spectrophotometry and beam profile reflectometry measurement of six layers in an SOI film stack", Proc. SPIE 2877, Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing III, (13 September 1996); https://doi.org/10.1117/12.250935

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