Paper
4 April 1997 New processing approach for grafting optoelectronic devices and applications to multichip modules
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Abstract
Epitaxial liftoff and grating of multiple thin integrated circuit-sized semiconductor films each containing over a hundred discrete devices confirms that multichip modules can be produced using this technology. the use of epitaxial liftoff membranes containing electronic and optoelectronic circuits and devices will provide (1) highly improved thermal management, (2) much higher density packaging, and (3) applications polylithically interconnecting electronic mixed-signal and optoelectronic devices. Bond strength data of thin epitaxial membranes grafted onto high thermal conductivity substrates quantifies for the first time to our knowledge the adhesion quality of van der Waals forces. In addition, the handling of very small discrete devices by means of integrated circuit-sized thin films permits the use of commercial off-the-shelf hardware in the development of an automated manufacturing assembly tool. This enabling technology will provide a manufacturing path to continue to commercialize new models of high performance optoelectronic modules with advanced features including higher data rates and increased function.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Charles B. Morrison, Ronald L. Strijek, and James H. Bechtel "New processing approach for grafting optoelectronic devices and applications to multichip modules", Proc. SPIE 3005, Optoelectronic Interconnects and Packaging IV, (4 April 1997); https://doi.org/10.1117/12.271079
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CITATIONS
Cited by 5 scholarly publications.
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KEYWORDS
Epitaxial lateral overgrowth

Thin films

Optoelectronic devices

Integrated circuits

Nanolithography

Manufacturing

Gallium arsenide

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