Paper
15 September 1995 Manufacturable multimaterial integration: compound semiconductor devices bonded to silicon circuitry
Nan Marie Jokerst, Martin A. Brooke, Olivier Vendier, Scott T. Wilkinson, Suzanne M. Fike, Myunghee Lee, Brent Buchanan, D. Scott Wills, April S. Brown
Author Affiliations +
Abstract
The integration of thin film optoelectronic devices with host substrates such as circuits, waveguides, and micromachines offers to the systems engineer the freedom to choose the optimal materials to achieve performance and cost objectives. In essence, the bonding of the thin film components becomes an integral part of the system packaging. The fabrication and integration of thin film compound semiconductor optoelectronic devices with a number of host substrates is presented. Thin film devices have been integrated with silicon circuits, and movable micromachines, and have been used to demonstrate three dimensionally interconnected systems. The three dimensionally integrated systems include detector arrays bonded directly on top of circuits for massively parallel processing of images, and vertical optical interconnections have been demonstrated between stacked layers of silicon circuits (which are transparent to the wavelength of light used) for a massively parallel processing architecture based upon low memory and high input/output.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nan Marie Jokerst, Martin A. Brooke, Olivier Vendier, Scott T. Wilkinson, Suzanne M. Fike, Myunghee Lee, Brent Buchanan, D. Scott Wills, and April S. Brown "Manufacturable multimaterial integration: compound semiconductor devices bonded to silicon circuitry", Proc. SPIE 2524, National Science Foundation (NSF) Forum on Optical Science and Engineering, (15 September 1995); https://doi.org/10.1117/12.219568
Lens.org Logo
CITATIONS
Cited by 2 patents.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Silicon

Thin film devices

Silicon films

Thin films

Etching

Sensors

Manufacturing

Back to Top