Characterization of low-viscosity photoresist coating

Murthy S. Krishna; John W. Lewellen; Gary E. Flores

doi:10.1117/12.312355

29 June 1998 Characterization of low-viscosity photoresist coating

Murthy S. Krishna, John W. Lewellen, Gary E. Flores

Proceedings Volume 3333, Advances in Resist Technology and Processing XV; (1998) https://doi.org/10.1117/12.312355
Event: 23rd Annual International Symposium on Microlithography, 1998, Santa Clara, CA, United States

Abstract

With the semiconductor industry moving towards deeper submicron device geometries, lithography is an increasingly critical step in the semiconductor manufacturing process. This places great emphasis on attaining tighter resist thickness uniformity. Tighter uniformity and elimination of coating anomalies is critical for optimal alignment accuracy and linewidth control. The use of low viscosity photoresists for less than 7000 angstroms film thickness is important due to the higher degree of substrate planarization and need for improved lithographic resolution. The objective of this project was to characterize low viscosity coating characteristics. The work was done on a SVG 90S track system. The viscosities of resists used were less than 10 cp.

Citation Download Citation

Murthy S. Krishna, John W. Lewellen, and Gary E. Flores "Characterization of low-viscosity photoresist coating", Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); https://doi.org/10.1117/12.312355

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