Direct writing of electronic materials using a new laser-assisted transfer/annealing technique

Alberto Pique; J. M. Fitz-Gerald; Douglas B. Chrisey; Raymond C. Y. Auyeung; H. D. Wu; Samuel Lakeou; Robert Andrew McGill

doi:10.1117/12.387545

7 June 2000 Direct writing of electronic materials using a new laser-assisted transfer/annealing technique

Alberto Pique, J. M. Fitz-Gerald, Douglas B. Chrisey, Raymond C. Y. Auyeung, H. D. Wu, Samuel Lakeou, Robert Andrew McGill

Author Affiliations +

Proceedings Volume 3933, Laser Applications in Microelectronic and Optoelectronic Manufacturing V; (2000) https://doi.org/10.1117/12.387545
Event: Symposium on High-Power Lasers and Applications, 2000, San Jose, CA, United States

Abstract

MAPLE direct write is anew laser-based direct write technique which combines the basic approach employed in laser induced forward transfer with the unique advantages of matrix assisted pulsed laser evaporation. The technique utilizes a laser transparent donor substrate with one side coated with a matrix consisting of the electronic material to be transferred mixed with an organic binder or vehicle. As with LIFT, the laser is focused through the transparent substrate onto the matrix coating. When a laser pulse strikes the coating, the matrix is transferred to an acceptor substrate placed parallel to the donor surface. Ex situ thermal or laser treatments can be used to decompose the matrix and anneal the transferred material, thus forming structures with the desired electronic properties. MAPLE DW is a maskless deposition process designed to operate in air and at room temperature that allows for the generation of complex patterns with micron scale linewidths. The various structures produced by MAPLE DW were characterized using 3D surface profilometry, scanning electron microscopy and optical microscopy. The electrical resistivity of the silver metal lines made by MAPLE DW was measured using an impedance analyzer. Patterns with Zn₂SiO₄:Mn powders were fabricated over the surface of a dragon fly wing without damaging it. An overview of the key elements of the MAPLE DW process including our current understanding of the material transfer mechanisms and its potential as a rapid prototyping technique will be discussed.

Citation Download Citation

Alberto Pique, J. M. Fitz-Gerald, Douglas B. Chrisey, Raymond C. Y. Auyeung, H. D. Wu, Samuel Lakeou, and Robert Andrew McGill "Direct writing of electronic materials using a new laser-assisted transfer/annealing technique", Proc. SPIE 3933, Laser Applications in Microelectronic and Optoelectronic Manufacturing V, (7 June 2000); https://doi.org/10.1117/12.387545

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