Paper
7 June 2000 TiN growth by hybrid radical beam-PLD for Si barrier metal
Kotaro Obata, Koji Sugioka, Koichi Toyoda, Hiroshi Takai, Katsumi Midorikawa
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Abstract
Combination of PLD and nitrogen radical beam has grown high quality TiN films on Si substrate without silicidation at the interface between TiN thin film and Si substrate even at growth temperature more than 700 degrees C. Additionally, X- ray photoelectron spectroscopy revealed that this method achieved synthesis of almost stoichiometric TiN films. Diffusion barrier characteristics of the grown film were examined by deposition of Al thin films of about 400 nm thick on the TiN grown films, followed by post-thermal treatment at 500 degrees C for 30 minutes. Scanning electron microscopy (SEM) observation and Rutherford backscattering spectroscopy analysis revealed that sharp interfaces between Al and TiN were maintained after the thermal treatment, indicating excellent property of the TiN films as Si barrier metal.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kotaro Obata, Koji Sugioka, Koichi Toyoda, Hiroshi Takai, and Katsumi Midorikawa "TiN growth by hybrid radical beam-PLD for Si barrier metal", Proc. SPIE 3933, Laser Applications in Microelectronic and Optoelectronic Manufacturing V, (7 June 2000); https://doi.org/10.1117/12.387552
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Tin

Nitrogen

Silicon

Thin films

Metals

Interfaces

Aluminum

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