Paper
24 May 2000 Vertically integrated photonic multichip module architecture for vision applications
Armand R. Tanguay Jr., B. Keith Jenkins, Christoph von der Malsburg, Bartlett Mel, Gary Holt, John D. O'Brien, Irving Biederman, Anupam Madhukar, Patrick Nasiatka, Yunsong Huang
Author Affiliations +
Proceedings Volume 4089, Optics in Computing 2000; (2000) https://doi.org/10.1117/12.386880
Event: 2000 International Topical Meeting on Optics in Computing (OC2000), 2000, Quebec City, Canada
Abstract
The development of a truly smart camera, with inherent capability for low latency semi-autonomous object recognition, tracking, and optimal image capture, has remained an elusive goal notwithstanding tremendous advances in the processing power afforded by VLSI technologies. These features are essential for a number of emerging multimedia- based applications, including enhanced augmented reality systems. Recent advances in understanding of the mechanisms of biological vision systems, together with similar advances in hybrid electronic/photonic packaging technology, offer the possibility of artificial biologically-inspired vision systems with significantly different, yet complementary, strengths and weaknesses. We describe herein several system implementation architectures based on spatial and temporal integration techniques within a multilayered structure, as well as the corresponding hardware implementation of these architectures based on the hybrid vertical integration of multiple silicon VLSI vision chips by means of dense 3D photonic interconnections.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Armand R. Tanguay Jr., B. Keith Jenkins, Christoph von der Malsburg, Bartlett Mel, Gary Holt, John D. O'Brien, Irving Biederman, Anupam Madhukar, Patrick Nasiatka, and Yunsong Huang "Vertically integrated photonic multichip module architecture for vision applications", Proc. SPIE 4089, Optics in Computing 2000, (24 May 2000); https://doi.org/10.1117/12.386880
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KEYWORDS
Diffractive optical elements

Modulators

Silicon

Sensors

Augmented reality

Vertical cavity surface emitting lasers

Very large scale integration

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