SOI micromachining technologies for MEMS

Stephane Renard

doi:10.1117/12.396430

25 August 2000 SOI micromachining technologies for MEMS

Stephane Renard

Proceedings Volume 4174, Micromachining and Microfabrication Process Technology VI; (2000) https://doi.org/10.1117/12.396430
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States

Abstract

The industrial use of SOI substrates is quickly spreading. For microelectronics applications, this material brings new functionality such as radiation-hard, high voltage or low voltage and low consumption integrated circuits. Industrial wafers are now commercially available and new technologies, such as Smart Cut from SOITEC company, will provide low price in high volume production. SOI brings also very important features in MEMS. TRONICS Microsystems, a manufacturer of customers specific MEMS on Surface and bulk micromachining produces MEMS components, such as high temperature and low noise piezo resistive pressure sensor or miniature high performances capacitive pressure and acceleration sensors, using SOI wafers. One of the process used: the Epi-SOI surface micromachining has become a new generic technology that will provide various industrial products in the near future.

Citation Download Citation

Stephane Renard "SOI micromachining technologies for MEMS", Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); https://doi.org/10.1117/12.396430

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