Advances in silicon-to-glass bonding with laser

Michael J. Wild; Arnold Gillner; Reinhart Poprawe

doi:10.1117/12.425293

30 April 2001 Advances in silicon-to-glass bonding with laser

Michael J. Wild, Arnold Gillner, Reinhart Poprawe

Proceedings Volume 4407, MEMS Design, Fabrication, Characterization, and Packaging; (2001) https://doi.org/10.1117/12.425293
Event: Microelectronic and MEMS Technologies, 2001, Edinburgh, United Kingdom

Abstract

In this work low temperature bonding of silicon and glass wafers for MEMS applications by the application of a Nd:YAG Laser using the transmission welding principle is examined. With this method the Laser beam is transmitted through the glass wafer and absorbed by the silicon at the silicon-glass interface. The resulting heated zone leads to locally selective bonding in spot and line shape with line width of 300 micrometers and less. The scope of the work is to characterize the Laser bonding (LB) technology and the quality of the produced silicon-glass joints. The continuous Laser power applied was between 12 and 30 W and the scribing velocity was between 50 and 500 mm/min. The measurements of the thermal load in the silicon during LB performed with micro-thermocouples show temperatures near the bonding zone around 300 degree(s)C for less than one second. The produced joints were found to have tensile strength between 5 and 10 MPa, which is comparable with other bonding methods. Hermetic tightness was proved with a helium leak detector and leak rates around 3(DOT)10^-8 mbar(DOT)l(DOT)s^-1 were found. Finally it will be discussed in which cases LB could be a supplement to anodic bonding, which is the state of the art bonding method for silicon-glass couples. Conclusively it can be said that locally selective LB is a novel method for MEMS packaging, with high bonding velocity, low thermal load for the joining partners and high bonding quality concerning strength and hermetic tightness.

Citation Download Citation

Michael J. Wild, Arnold Gillner, and Reinhart Poprawe "Advances in silicon-to-glass bonding with laser", Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); https://doi.org/10.1117/12.425293

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available